IEEE Communications Society’s Presence at the 4th Additive Manufacturing (AM) Summit Series–Emerging Applications Summit

By Ewell Tan - IEEE APO Office, Singapore

Being one of the supporting organizations, the IEEE Communications Society exhibited at the 4th Additive Manufacturing (AM) Summit Series–Emerging Applications Summit, on 7 November 2017 at the Raffles City Convention Centre in Singapore.

This event was organized by the National Additive Manufacturing Innovation Cluster (a.k.a. NAMIC), which aims to increase Singapore’s adoption of additive manufacturing technologies to enhance competitiveness in the rapidly evolving landscape of digital industrialization. More than 400 industry players, high-level company decision makers, regulators, researchers, engineers and solutions providers, attended this summit to discuss the role of 3D printing in emerging applications and new design possibilities realized by 3D printing. This Summit is also strongly supported by the Singapore National Research Foundation (NRF) and NTUitive Pte. Ltd.

The Director of IEEE Asia Business Development, Leo Hwa Chiang, collaborated with the event organizer to show the presence of the IEEE Communications Society at this Summit. Richard Chandra, Ewell Tan and Nitcer Chong from the IEEE Singapore office helped man the exhibit booth to showcase and promote IEEE and the IEEE Communications Society to industry practitioners. One of the highlights was when the non-resident Ambassador to the Sultanate of Oman, Mr. Teng Theng Dar, who was also the Guest of Honor of this Summit, visited the IEEE ComSoc booth and showed interest in IEEE, as the world’s largest technical professional association for engineers.